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Rigid HDI Circuit Board

Product Specification:
  • Layer Count: 4-20
  • Layer Builds: 3+N+3, Anylayer
  • Min Hole: 0.1mm
  • Min Trace/Spcing: 2/2mil
  • Min BGA Pitch: 0.25mm

Advanced HDI Circuit Board

HDI circuit board refers to the one with a relatively high trace distribution density using micro-blind/buried via technology, which is commonly used in narrow spaces. High density interconnection technology enables the end-product designs to be more compact while meeting higher standards of electronic performance and efficiency.

PS electronics has got 26 years experience, who uses optimizing processing together with advanced equipment to make multi-layer HDI circuit boards. Any-layer builds, 2mil trace/spacing0.25mm BGA are all available options. Our HDI circuit board is currently widely used in communication backplanes, mobile phones, camera, notebook, automotive electronics, etc.




Manufacturer: PS Electronics

Base Material: FR4 Tg140, FR4 Tg170, Rogers, PTFE, etc.

Surface Finishing: HASL LF, ENIG, OSP, IAg, ISn, etc.

Layer Count: 4-20

Layer Builds: 3+N+3, Anylayer

Min. Drilling/Laser Hole: 0.15/0.1mm

Min. Trace/Spcing: 2/2mil

Min. BGA Pitch: 0.25mm

Impedance Control: YES



Stack-up Diagram of HDI Circuit Boards

Stack-up of HDI Circuit Boards



PCB Manufacturing Flow

PCB Manufacturing Processing



Company Certificates

PS Certificates


Manufacturing Capacities

PCB capacity PCB assembly capacity Other PCB products



Terms & Conditions

  1. Payment Terms: By T/T  30 days after shipping
  2. Payment Methods: T/T or Paypal
  3. Price Terms: FOB, CIF+Delivery, DDU, DAP
  4. Shipment Methods: UPS, DHL, TNT, FEDEX, BY SEA, BY TRAIN, or BY AIR
  5. Inspection Criteria: IPC 6012 at AQL 0.65%
  6. PCB Package: Anti-Static Bags
  7. Production time starts from EQ confirmed




Q1: What is the advantage of your HDI circuit board?

a. Compared with traditional manufacturing methods, HDI technology for multilayer boards (>=8) will save production costs
b. Greater interconnect density, smaller product volume
c. Better RFI / EMI / ESD properties
d. Excellent electrical performance and more reliable

Q2: What’s your aspect ratio of blind vias? 

About 0.8:1

Q3: Is 20 layers your limit? 

Not exactly, we can reach 26 layers, which depends on designs, but just for prototyping.

Q4: Which files are needed for manufacturing?

Gerber file (RS-274-X), and descriptions of laminate, impedance and via stackup will help.

Q5: What’s your payment terms?

By T/T  30 days after shipping



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Contact PS for your HDI circuit boards


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